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              當前位置:主頁 > 產品中心 > 主控芯片

              RK3368

              RK3368 is a low power, high performance octal-core Cortex-A53 processor for mobile phones
              型號:RK3368
              品牌:ROCKCHIP
              封裝:TFBGA453
              批號:15+
              庫存:700

              規格書(Datesheet):RK3368.PDF 點擊下載

              商品信息

                        RK3368 is a low power, high performance processor for mobile phones, personal mobile internet device and other digital multimedia applications, and integrates octal-core Cortex-A53 with separately NEON coprocessor. (點擊即可咨詢芯片詳細信息

              RK3368’s Features
              1、 MicroProcessor
              - Octal-core ARM Cortex-A53 MPCore processor, a high-performance,
              low-power and cached application processor
              - Two CPU clusters, with four CPU core for each cluster, One cluster is
              optimized for high-performance(big cluster) and the other is optimized for
              low power(little cluster)
              - Full implementation of the ARM architecture v8-A instruction set, ARM Neon
              Advanced SIMD (single instruction, multiple data) support for accelerated
              media and signal processing computation
              - ARMv8 Cryptography Extensions
              - In-order pipeline with symmetric dual-issue of most instructions.
              - Harvard Level 1 (L1) memory system with a Memory Management Unit
              (MMU).
              - Level 2 (L2) memory system providing cluster memory coherency, including
              an L2 cache.
              - Include VFP v3 hardware to support single and double-precision add,
              subtract, divide, multiply and accumulate, and square root operations
              - SCU ensures memory coherency between the four CPUs
              - CCI400 ensures the memory coherency between the two clusters
              - Integrated 32KB L1 instruction cache , 32KB L1 data cache with 4-way set
              associative
              - 512MB unified L2 Cache for big cluster, 256KB unified L2 Cache for little
              cluster
              - Trustzone technology support
              - Full coresight debug solution
              - Ten separate power domains for every core to support internal power switch
              and externally turn on/off based on different application scenario
              - One isolated voltage domain to support DVFS
              - Maximum frequency can be up to 900MHz@0.9V for Cortex-A53 big cluster
              - Maximum frequency can be up to 750MHz@0.9V for Cortex-A52 little
              cluster
              2、 Memory Organization
              - Internal on-chip memory
              - External off-chip memory①
              3、Internal Memory
              - Internal BootRom
              - Internal SRAM
              4、External Memory or Storage device
              - Dynamic Memory Interface (DDR3/DDR3L/LPDDR2/LPDDR3)
              - Nand Flash Interface
              - eMMC Interface
              - SD/MMC Interface
              5、System Component
              - CRU (clock & reset unit)
              - PMU(power management unit)
              - Timer
              - PWM
              - WatchDog
              - Bus Architecture
              - Interrupt Controller
              - DMAC
              - Security system
              6、 Video CODEC
              - Shared internal memory and bus interface for video decoder and encoder②
              - Embedded memory management unit(MMU)
              - Video Decoder
              - Video Encoder
              7、 HEVC Decoder
              - Main/Main10 HEVC/H.265 decoder
              - 4k@60FPS (core clock@300Mhz)
              - Support up to 4096x2304 resolution
              - Support up to 100Mbps bit rate
              - Embedded memory management unit(MMU)
              - Stream error detector (28 IDs)
              - Internal 128k cache for bandwidth reduction
              - Multi-clock domains and auto clock-gating design for power saving
              8、 JPEG CODEC
              - JPEG decoder
              - JPEG encoder
              9、 Image Enhancement
              - Image pre-processor
              - Video stabilization
              - Image Post-Processor (embedded inside video decoder)
              10、 Graphics Engine
              - 3D Graphics Engine :
              - Base handheld architecture fully Microsoft® DirectX™ 9.3, OpenGL®
              3.1, and OpenGL ES 3 compliant
              - Support for pull-model attribute evaluation
              - Tile-based deferred rendering architecture with concurrent processing
              of multiple tiles
              - Multi-threaded Unified Shading Cluster (USC) engine
              11、Video IN/OUT
              - Camera Interface(interface only)
              - Camera Interface and Image Processer(Interface and Image Processing)
              - Display Interface
              12、HDMI
              - Single Physical Layer PHY with support for HDMI 1.4 and 2.0 operation
              - Support HDCP 1.4
              - Support HDCP 2.2
              13、MIPI_DSI/LVDS/TTL combo PHY
              - MIPI_TX
              - LVDS
              - TTL
              14、MIPI_CSI PHY
              - Embedded one MIPI_CSI PHY
              - Support 4 data lane, providing up to 4Gbps data rate
              15、eDP PHY
              - Support 4Kx2K @ 30fps
              - Compliant with eDP TM Specification, version 1.1
              - Up to 4 physical lanes of 2.7/1.62 Gbps/lane(HBR2/HBR/RBR)
              - RGB, YCbCr 4:4:4, YCbCr 4:2:2 and 8/10/12 bit per component video format
              - Encoded bit stream (Dolby Digital, or DTS) – IEC61937 compliant
              - Support VESA DMT and CVT timing standards
              - Fully support EIA/CEA-861D video timing and Info Frame structure
              - Hot plug and unplug detection and link status monitor
              - Support DDC/CI and MCCS command transmission when the monitor
              includes a display controller.
              - Supports Panel Self Refresh(PSR)
              16、 Audio Interface
              - I2S/PCM with 8ch
              - I2S/PCM with 2ch
              - SPDIF
              17、 Connectivity
              - SDIO interface
              - High-speed ADC stream interface
              - TS interface
              - Smart Card
              - GMAC 10/100/1000M Ethernet Controller
              - SPI Controller
              - Uart Controller
              - I2C controller
              - GPIO
              - USB Host2.0
              - USB OTG2.0
              - HSIC Interface
              18、 Others
              - Temperature Sensor(TS-ADC)
              - SAR-ADC(Successive Approximation Register)
              - eFuse
              - Operation Temperature Range:-40C to +85C
              - Operation Voltage Range:Core supply: 1.0V (±10%) IO supply : 3.3V or 2.5V or 1.8V (±10%)
              - Process :GlobalFoundry 28nmSLP
              - Package Type
                                TFBGA453LD(body: 19mm x 19mm; ball size: 0.4mm; ball pitch:0.8mm)
               
              RK3368’s Block Diagram
               RK3368's Block Diagram
              RK3368’s Package

               RK3368's PackageRK3368's Package

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